Thermalsilicafilm"Thermalsilicagelsheet"isakindofheatconductivemediummaterialwhichissynthesizedbyaspecialprocessbyaddingvariousauxiliarymaterialssuchasmetaloxidetothebasematerialofsilicagel.Intheindustry,itisalsocalledthermalsilicagelpad,thermalconductivefilm,soft.Thermalpad,thermalsiliconegasket,etc.,arespeciallydesignedfortheuseofheattransferthroughthegap,canfillthegap,completetheheattransferbetweenthehotpartandtheheatpart,andalsoplaytheroleofinsulation,shockabsorption,sealing,etc.Itcanmeetthedesignrequirementsofminiaturizationandultra-thinnessofequipment.Itishighlytechnicalandusable,andhasawiderangeofthicknesses.Itisanexcellentthermalconductivefillingmaterial. AdvantagesanddisadvantagesofthermalsilicagelAdvantage 1.Thematerialissoft,thecompressionperformanceisgood,thethermalinsulationperformanceisgood,thethicknesscanbeadjustedinawiderange,suitableforfillingthecavity,thetwosideshavenaturalviscosity,andtheoperabilityandmaintainabilityarestrong; 2.Themainpurposeofselectingathermalconductivesiliconesheetistoreducethecontactthermalresistancegeneratedbetweenthesurfaceoftheheatsourceandthecontactsurfaceoftheheatsinkmember,andthethermalconductivesiliconesheetcanwellfillthegapofthecontactsurface; 3,becausetheairisapoorconductorofheat,itwillseriouslyhinderthetransferofheatbetweenthecontactsurfaces,andthethermalconductivesilicagelsheetbetweentheheatsourceandtheheatsinkcansqueezetheairoutofthecontactsurface; 4,withtheadditionofthermalsilicagelsheet,thecontactsurfacebetweentheheatsourceandtheheatsinkcanbebettercontacted,andtheface-to-facecontactistrulyachieved.Thereactionattemperaturecanachieveassmallatemperaturedifferenceaspossible; 5.Thethermalconductivityofthethermalconductivesilicagelsheethascontrollabilityandthermalconductivitystabilityisalsobetter; 7.Thethermalconductivityofthesilicagelsheetinthestructureisreduced,andtheprocessdifferenceoftheheatsinkandtheheatdissipationstructuralmemberisreduced; 8.Thethermalconductivesiliconesheethasinsulationproperties(thisfeaturerequirestheadditionofsuitablematerialsduringproduction); 9.Thethermalconductivesiliconesheethastheeffectofshockabsorptionandsoundabsorption; 10.Thethermalconductivesiliconesheethastheconvenienceofinstallation,testingandreusability. Disadvantage Relativetothermalgrease,thermalsilicahasthefollowingdisadvantages: 1.Althoughthethermalconductivityishigherthanthatofthermalgrease,thethermalresistanceisalsohigherthanthatofthermalsilica. 2.Thethermalconductivesiliconesheetwithathicknessoflessthan0.5mmiscomplicatedinprocessandrelativelyhighinthermalresistance; 3,thermalgreasegreasetemperaturerangeislarger,theyarerespectivelythermalgrease-60°C~300°C,thermalsilicagelsheet-50°C~220°C; 4,theprice:thermalgreasehasbeenwidelyused,thepriceislower,thermalsilicafilmisusedinthinandsophisticatedelectronicproductssuchasnotebookcomputers,thepriceisslightlyhigher. Thermalsilicafilmuse1,LEDTVvideoequipment 2,networkplayer,householdappliances 3,mobilepowerLEDlighting 4,backlightmoduleswitchingpowersupply 5,medicalequipment,communicationequipment 6,PCserverbasestation Applicationfieldofthermalsilicagelsheet1.Automotiveelectronicsindustryapplication SuchasXenonlampballasts,audio,batterymodules,carseriesproducts,etc.,canbeusedtothermalsilicafilm   2,LEDindustryuse Athermallyconductivesiliconesheetisusedbetweenthealuminumsubstrateandtheheatsink;athermallyconductivesiliconesheetisusedbetweenthealuminumsubstrateandtheoutercasing. 3,homeapplianceindustry Microwaveoven/airconditioner(betweenfanmotorpowerICandcase)/inductioncooker(betweenthermistorandheatsink). 4,PDP/LEDTVapplication ThermalconductivitybetweentheefficacyIC,theimagedecoderIC,andtheheatsink(housing).   5,thecommunicationsindustry Theheatdissipationbetweentheset-topboxDC-DCICandthecaseissuchasheatdissipation. Howtousethermalsilicagelsheet1.Keepthesurfaceoftheheat-conductingsilicagelcleanandavoidthecontaminationofthethermalconductivesilicagelsheet.Theself-adhesiveandsealingthermalconductivityofthedirtythermalconductivesiliconesheetwilldeteriorate. 2.Whentakingthethermalsilicagelsheet,thelarge-areaheat-conductingsilicagelsheetshouldbegrabbedfromthecenter.Thesmaller-areasheetisnotrequiredtobegrabbed,becausethelarge-sizedthermalsilicasheetisunevenlystressed,whichwillcausedeformationandaffect.Subsequentoperationsevendamagethesiliconesheet. 3.Takethesheetinthelefthandandtearoffoneoftheprotectivefilmontherighthand.Theprotectivefilmonbothsidescannotberemovedatthesametime,reducingthenumberandareaof​​directcontactwiththethermalconductivesiliconesheet,andmaintainingtheself-adhesivenessandthermalconductivityofthethermalconductivesiliconesheetfrombeingdamaged. 4.Removethesideoftheprotectivefilmandfacetheheatsink.Alignthethermalconductivesiliconesheetwiththeheatsink.Whenthethermalsilicagelsheetisslowlylowered.Becarefultoavoidthegenerationofairbubbles. 5.Ifbubblesaregeneratedduringoperation,youcanpullupthesiliconesheetandrepeattheabovesteps,oruseatooltogentlywipeoffthebubbles,buttheforceistoolargetoavoiddamagetothethermalsilicafilm. 6.R